The global thermal management technologies market is estimated to be USD 14.7 billion by 2027 from USD 9.5 billion in 2020 at a CAGR of 6.4 % between 2020 to 2027. Advancements in the electronics industry have led to a significant increase in the power densities, which, in turn, have driven the development of smaller and smarter products. The increasing need for advanced heat dissipation solutions in these smaller products is expected to drive the industry growth soon.
In the past few years, the traditional electronic and electrical industry has become technology savvy, where consumer demands and needs are driving the manufacture and design of products. The industry responded to the demand with innovations, providing systems with enhanced power and by meeting the needs of consumers.
The chip-cooling solutions have evolved over the past few years to accommodate the increase in heat flux. Manufacturers are working on the development of advanced cooling solutions based on multi-phase heat transfer technologies. Technologies, such as jet impingement mechanisms, cold plates, and heat vapor chambers, have revolutionized the future of these systems.
However, various components and system-level technological issues, such as heat effect on transistor operation, spatial and temporal variation in the heat load, multiple heat transfer interface, and acoustic noise emissions, are presumed to challenge technological advancements. These challenges are expected to impact market growth negatively over the forecast period.
Some of the prominent players of the global thermal management technologies market includes PARKER HANNIFIN CORP, Gentherm, Autoneum Holding AG, Advanced Cooling Technologies, Inc., AllCell Technologies LLC., Thermacore, Inc., INHECO Industrial Heating & Cooling GmbH., GOUSHOU Technology Corp., Bergquist Company, Inc. and Outlast Technologies LLC.
The Asia Pacific is envisioned to emerge as a key revenue-generating region over the forecast period owing to the presence of a large number of electronics manufacturers in the region coupled with the increasing adoption of heat dissipation solutions to improve the heat dissipation in next-generation electronics. In addition to this, increasing government initiatives promoting the adoption of renewable energy sources, such as solar cells, are presumed to drive the regional industry in the coming years.
Europe is expected to witness significant growth over the forecast period owing to its compliance with stringent EU regulations and directives about the usage of thermal interface materials in various electronic devices. The increased awareness among the regional population regarding the environment is predicted to boost the adoption of eco-friendly heat management solutions across various applications. The region encompasses several advanced electronic designing and R&D facilities in countries, such as Germany and the UK, which in turn is presumed to boost the adoption of these technologies in the region.
In the past few years, the traditional electronic and electrical industry has become technology savvy, where consumer demands and needs are driving the manufacture and design of products. The industry responded to the demand with innovations, providing systems with enhanced power and by meeting the needs of consumers.
The chip-cooling solutions have evolved over the past few years to accommodate the increase in heat flux. Manufacturers are working on the development of advanced cooling solutions based on multi-phase heat transfer technologies. Technologies, such as jet impingement mechanisms, cold plates, and heat vapor chambers, have revolutionized the future of these systems.
However, various components and system-level technological issues, such as heat effect on transistor operation, spatial and temporal variation in the heat load, multiple heat transfer interface, and acoustic noise emissions, are presumed to challenge technological advancements. These challenges are expected to impact market growth negatively over the forecast period.
Some of the prominent players of the global thermal management technologies market includes PARKER HANNIFIN CORP, Gentherm, Autoneum Holding AG, Advanced Cooling Technologies, Inc., AllCell Technologies LLC., Thermacore, Inc., INHECO Industrial Heating & Cooling GmbH., GOUSHOU Technology Corp., Bergquist Company, Inc. and Outlast Technologies LLC.
The Asia Pacific is envisioned to emerge as a key revenue-generating region over the forecast period owing to the presence of a large number of electronics manufacturers in the region coupled with the increasing adoption of heat dissipation solutions to improve the heat dissipation in next-generation electronics. In addition to this, increasing government initiatives promoting the adoption of renewable energy sources, such as solar cells, are presumed to drive the regional industry in the coming years.
Europe is expected to witness significant growth over the forecast period owing to its compliance with stringent EU regulations and directives about the usage of thermal interface materials in various electronic devices. The increased awareness among the regional population regarding the environment is predicted to boost the adoption of eco-friendly heat management solutions across various applications. The region encompasses several advanced electronic designing and R&D facilities in countries, such as Germany and the UK, which in turn is presumed to boost the adoption of these technologies in the region.
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