Flip Chip Technologies Market by packaging technology (2.5D IC, 3D IC and 2D IC), by bumping technology (Copper Pillar, Gold Bumping, Solder Bumping and Others), by end user (Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others), by Region (North America, Latin America, Europe, Asia-Pacific and Middle East & Africa) and Industry Analysis, Opportunity and Forecast 2021 To 2027
Published Date: Aug 2020
No. of Pages: 180
Status: Published
Report Code: ARI100879
Summary
The flip chip technology market size was valued at USD 24.80 billion in 2020, and is likely to reach USD 39.70 billion by 2027, growing at a CAGR of 6.1% from 2021 to 2027. Flip chip, also identified as controlled collapse chip connection that consists of conductive bumps deposited on chip pads on the surface of wafer, followed by mounting semiconductor devices by flipping the chip. The agreement of flip chip has increased in the electronic industry due to its frequent advantages such as lower cost, high packaging density, improved reliability of circuits, and compact dimensions. Thus, the increased demand for smart electronics across the globe is a major factor expected to drive the growth of the global flip chip market size during the estimate period. Additionally, flip chip has developed the portable electronics and electric vehicle industries by proving to be an ideal product for electrical interconnections.
Being a technologically focused market, manufacturers are primarily focusing on innovations and new technologies for the bumping process, which in turn is increasing the demand for raw materials required for manufacturing. Some of the major key players are 3M Company, Advanced Micro Devices Inc, Fujitsu Limited, Intel Corporation, Amkor Technology Inc, Apple Inc, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company, Amkor Technology Inc., UTAC Holdings Ltd. In Aug 2019 Globalfoundries declared that it has taped-out an Arm-based 3D high-density test chip that can enable a new level of system performance and power efficiency for computing applications such as AI and high-end consumer mobile and wireless solutions.
Analyst Commentary
The increasing growth of the flip chip technology market is attributed to its many advantages, such as smaller-size, higher- performance, and enhanced Input/output flexibility over its competitive procedures. The growing demand of flip chip technology market is anticipated to increase in mobile and wireless, consumer applications, and high-performance applications like networks, servers and data centers. Due to the robust growth in (monolithic microwave IC), the market is growing as MMIC are devices that operate at microwave frequencies (300 MHz to 300 GHz). These procedures usually perform functions, such as microwave mixing, power amplification, low-noise amplification, and high-frequency switching.
COVID-19 has severely affected the market growth. This is due to shift of consumer purchasing behavior towards essential goods such as groceries, from luxury goods such as consumer electronics and vehicles. The supply chain was also affected, thus slowing down the market growth. Also, Flip chip technology is one of the ancient and commonly used for semiconductor packaging. Flip chip was originally familiarized by IBM 30 years ago. However, it is keeping up with times and developing new bumping solutions to serve advanced technologies such as 2.5D and 3D. The modern military and defense environment require verified, reliable and scalable technologies. For instance, a SiGe transmit-receive phased-array chip for automotive radar applications at 76 to 84 GHz has been developed.
Segmentation
Global flip chip technology market is segmented on the basis of packaging technology, the market is segmented into 2.5D IC, 3D IC and 2D IC. Now based on bumping technology, the market is segmented into Copper Pillar, Gold Bumping, Solder Bumping and Others. Further, based on end user, the market is segmented into Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others. Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa.
Regional Analysis
Geographically, the flip chip technology market has been bifurcated into five key regions including North America, Latin America, Europe, Asia-Pacific and Middle East & Africa. The global flip chip technology market is expected to record a higher CAGR during the forecast period. Asia-Pacific is expected to be the dominant market for flip chip technology market followed by North America and Europe. The flip chip technology market in Asia-Pacific region is expected to grow at highest CAGR over the estimate period. Countries such as China and India are major manufacturing centers and are likely to provide abundant opportunities for the growth of the flip chip technologies. The Chinese government has taken an initiative for “Made in China 2025” aims to make its semiconductor industry output by 2030, and meeting 80% of domestic demand. China is ramping up its chip industry among a developing tech war. The U.S.- China trade war and the threat that Chinese firms could cut off from American technology, is boosting China’s drive for its semiconductor industry.
TABLE OF CONTENTS
Chapter 1. Executive Summary
Chapter 2. Research Methodology
2.1. Research approach
2.2. Scope, definition, and assumptions
2.3. Data Component
2.3.1. Secondary Component
2.3.1.1. Preliminary data mining
2.3.2. Primary Component
2.3.2.1. Statistical Model
2.3.2.2. Data Triangulation
2.3.2.3. Research Objective
Chapter 3. Market Outlook
3.1. Introduction
3.2. Key trends
3.2.1. xx
3.3. Market drivers
3.3.1. Impact analysis of Market Drivers
3.4. Market restraints
3.4.1. Impact analysis of Market Restraints
3.5. Market opportunities
3.5.1. Impact analysis of Market Opportunities
3.6. Market Challenges
3.6.1. Impact analysis of Market Trends
3.7. Porter’s Five Forces’ analysis
3.7.1. Bargaining Power of Suppliers
3.7.2. Bargaining Power of Buyers
3.7.3. Threat of New Entrant
3.7.4. Threat of Substitutes
3.7.5. High Competitive Rivalry
3.8. Value chain analysis
Chapter 4. COVID-19 Impact On Flip Chip Technologies Market
Chapter 5. Global Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
5.1. Global Flip Chip Technologies Market Share, By Packaging Technology, 2015 - 2027 (USD Million)
5.1.1. 2.5D IC
5.1.1.1. Market Size and Projections,2015 - 2027 (USD Million)
5.1.1.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
5.1.2. 3D IC
5.1.2.1. Market Size and Projections,2015 - 2027 (USD Million)
5.1.2.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
5.1.3. 2D IC
5.1.3.1. Market Size and Projections,2015 - 2027 (USD Million)
5.1.3.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
Chapter 6. Global Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027(USD Million)
6.1. Global Flip Chip Technologies Market Share, By Bumping Technology, 2015 - 2027 (USD Million)
6.1.1. Copper Pillar
6.1.1.1. Market Size and Projections,2015 - 2027 (USD Million)
6.1.1.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
6.1.2. Gold Bumping
6.1.2.1. Market Size and Projections, 2015 - 2027 (USD Million)
6.1.2.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
6.1.3. Solder Bumping
6.1.3.1. Market Size and Projections, 2015 - 2027 (USD Million)
6.1.3.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
Chapter 7. Global Flip Chip Technologies Market Overview, By End-User, 2015 - 2027(USD Million)
7.1. Global Flip Chip Technologies Market Share, By End-User, 2015 - 2027 (USD Million)
7.1.1. Electronics
7.1.1.1. Market Size and Projections,2015 - 2027 (USD Million)
7.1.1.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
7.1.2. Automotive
7.1.2.1. Market Size and Projections, 2015 - 2027 (USD Million)
7.1.2.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
7.1.3. IT & Telecom
7.1.3.1. Market Size and Projections, 2015 - 2027 (USD Million)
7.1.3.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
7.1.4. Automotive
7.1.4.1. Market Size and Projections, 2015 - 2027 (USD Million)
7.1.4.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
7.1.5. Healthcare & Life Sciences
7.1.5.1. Market Size and Projections, 2015 - 2027 (USD Million)
7.1.5.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
7.1.6. Aerospace & Defense
7.1.6.1. Market Size and Projections, 2015 - 2027 (USD Million)
7.1.6.2. Market Size and Projections, by Region, 2015 - 2027 (USD Million)
Chapter 8. Global Flip Chip Technologies Market Overview, By Geography, 2015 - 2027(USD Million)
8.1. Global Flip Chip Technologies Market Share, By Geography, 2015 - 2027(USD Million)
8.1.1. Market Size and projections, by Countries, 2015 - 2027 (USD Million)
8.1.2. Market Share and CAGR Comparison, by Countries, 2020 - 2027 (%)
Chapter 9. North America Flip Chip Technologies Market Overview, By Countries, 2015 - 2027(USD Million)
9.1. North America Flip Chip Technologies Market Overview, 2015 - 2027 (USD Million)
9.1.1. Market Size and projections, 2015 - 2027 (USD Million)
9.1.2. North America Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
9.1.3. North America Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
9.1.4. North America Flip Chip Technologies Market Overview, By End-User, 2015 - 2027 (USD Million)
9.1.5. North America Flip Chip Technologies Market Overview, By Countries, 2015 - 2027 (USD Million)
9.1.5.1. U.S. Flip Chip Technologies Market Overview, 2015 - 2027 (USD Million)
9.1.5.1.1. Market Size and projections, 2015 - 2027 (USD Million)
9.1.5.1.2. U.S. Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
9.1.5.1.3. U.S. Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
9.1.5.1.4. Other Segment
9.1.5.2. Canada Flip Chip Technologies Market Overview, 2015 - 2027 (USD Million)
9.1.5.2.1. Market Size and projections, 2015 - 2027 (USD Million)
9.1.5.2.2. Canada Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
9.1.5.2.3. Canada Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
9.1.5.2.4. Other Segment
9.1.5.3. Mexico Flip Chip Technologies Market Overview, 2015 - 2027 (USD Million)
9.1.5.3.1. Market Size and projections, 2015 - 2027 (USD Million)
9.1.5.3.2. Mexico Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
9.1.5.3.3. Mexico Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
9.1.5.3.4. Other Segment
Chapter 10. Europe Flip Chip Technologies Market Overview, By Countries, 2015 - 2027(USD Million)
10.1. Europe Flip Chip Technologies Market Overview, 2015 - 2027 (USD Million)
10.1.1. Market Size and projections, 2015 - 2027 (USD Million)
10.1.2. Europe Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
10.1.3. Europe Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
10.1.4. Europe Flip Chip Technologies Market Overview, By End-User,2015 - 2027 (USD Million)
10.1.5. Europe Skin Care Sizes Market Overview, By Countries, 2015 - 2027 (USD Million)
10.1.5.1. Germany
10.1.5.1.1. Market Size and projections, 2015 - 2027 (USD Million)
10.1.5.1.2. Germany Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
10.1.5.1.3. Germany Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027(USD Million)
10.1.5.1.4. Other Segments
10.1.5.2. France
10.1.5.2.1. Market Size and projections, 2015 - 2027 (USD Million)
10.1.5.2.2. France Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
10.1.5.2.3. France Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027(USD Million)
10.1.5.2.4. Other Segments
10.1.5.3. UK
10.1.5.3.1. Market Size and projections, 2015 - 2027 (USD Million)
10.1.5.3.2. UK Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
10.1.5.3.3. UK Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027(USD Million)
10.1.5.3.4. Other Segments
10.1.5.4. Italy
10.1.5.4.1. Market Size and projections, 2015 - 2027 (USD Million)
10.1.5.4.2. Italy Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
10.1.5.4.3. Italy Flip Chip Technologies Market Overview, By Bumping Technology 2015 - 2027(USD Million)
10.1.5.4.4. Other Segments
10.1.5.5. Spain
10.1.5.5.1. Market Size and projections, 2015 - 2027 (USD Million)
10.1.5.5.2. Spain Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
10.1.5.5.3. Spain Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027(USD Million)
10.1.5.5.4. Other Segments
10.1.5.6. Rest of Europe
10.1.5.6.1. Market Size and projections, 2015 – 2027
10.1.5.6.2. Rest of Europe Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
10.1.5.6.3. Rest of Europe Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027(USD Million)
10.1.5.6.4. Other Segments
Chapter 11. Asia Pacific Flip Chip Technologies Market Overview, By Countries, 2015 - 2027 (USD Million)
11.1. Asia Pacific Flip Chip Technologies Market Overview, 2015 - 2027 (USD Million)
11.1.1. Market Size and projections, 2015 - 2027 (USD Million)
11.1.2. Asia Pacific Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
11.1.3. Asia Pacific Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
11.1.4. Asia Pacific Flip Chip Technologies Market Overview, By End-User,2015 - 2027 (USD Million)
11.1.5. Asia Pacific Flip Chip Technologies Market Overview, By Countries, 2015 - 2027 (USD Million)
11.1.5.1. India
11.1.5.1.1. Market Size and projections, 2015 - 2027 (USD Million)
11.1.5.1.2. India Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
11.1.5.1.3. India Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
11.1.5.1.4. Other Segments
11.1.5.2. China
11.1.5.2.1. Market Size and projections, 2015 - 2027(USD Million)
11.1.5.2.2. China Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
11.1.5.2.3. China Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
11.1.5.2.4. Other Segments
11.1.5.3. Japan
11.1.5.3.1. Market Size and projections, 2015 - 2027 (USD Million)
11.1.5.3.2. Japan Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
11.1.5.3.3. Japan Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027(USD Million)
11.1.5.3.4. Other Segments
11.1.5.4. South Korea
11.1.5.4.1. Market Size and projections, 2015 - 2027(USD Million)
11.1.5.4.2. South Korea Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
11.1.5.4.3. South Korea Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
11.1.5.4.4. Other Segments
11.1.5.5. Rest of Asia Pacific
11.1.5.5.1. Market Size and projections, 2015 - 2027 (USD Million)
11.1.5.5.2. Rest of Asia Pacific Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027(USD Million)
11.1.5.5.3. Rest of Asia Pacific Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
11.1.5.5.4. Other Segments
Chapter 12. Middle East & Africa Flip Chip Technologies Market Overview, By Countries, 2015 - 2027 (USD Million)
12.1. Middle East & Africa Flip Chip Technologies Market Overview, 2015 - 2027 (USD Million)
12.1.1. Market Size and projections, 2015 - 2027 (USD Million)
12.1.2. Middle East & Africa Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
12.1.3. Middle East & Africa Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
12.1.4. Middle East & Africa Flip Chip Technologies Market Overview, By End-User,2015 - 2027 (USD Million)
12.1.5. Middle East & Africa Flip Chip Technologies Market Overview, By Countries, 2015 - 2027 (USD Million)
12.1.5.1. GCC
12.1.5.1.1. Market Size and projections, 2015 - 2027 (USD Million)
12.1.5.1.2. GCC Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
12.1.5.1.3. GCC Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
12.1.5.1.4. Other Segments
12.1.5.2. South Africa
12.1.5.2.1. Market Size and projections, 2015 - 2027 (USD Million)
12.1.5.2.2. South Africa Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
12.1.5.2.3. South Africa Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
12.1.5.2.4. Other Segments
12.1.5.3. Rest of Middle East & Africa
12.1.5.3.1. Market Size and projections, 2015 - 2027 (USD Million)
12.1.5.3.2. Rest of Middle East & Africa Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
12.1.5.3.3. Rest of Middle East & Africa Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
12.1.5.3.4. Other Segments
Chapter 13. South America Flip Chip Technologies Market Overview, By Countries, 2015 - 2027 (USD Million)
13.1. South America Flip Chip Technologies Market Overview, 2015 - 2027 (USD Million)
13.1.1. Market Size and projections, 2015 - 2027 (USD Million)
13.1.2. South America Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
13.1.3. South America Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
13.1.4. South America Flip Chip Technologies Market Overview, By End-User,2015 - 2027 (USD Million)
13.1.5. South America Flip Chip Technologies Market Overview, By Countries, 2015- 2026 (USD Million)
13.1.6. Brazil
13.1.6.1. Market Size and projections, 2015 - 2027 (USD Million)
13.1.6.2. Brazil Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
13.1.6.3. Brazil Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
13.1.6.4. Other Segments
13.1.7. Argentina
13.1.7.1. Market Size and projections, 2015 - 2027 (USD Million)
13.1.7.2. Argentina Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
13.1.7.3. Argentina Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
13.1.7.4. Other Segments
13.1.8. Rest of South America
13.1.8.1. Market Size and projections, 2015 – 2027
13.1.8.2. Rest of South America Flip Chip Technologies Market Overview, By Packaging Technology, 2015 - 2027 (USD Million)
13.1.8.3. Rest of South America Flip Chip Technologies Market Overview, By Bumping Technology, 2015 - 2027 (USD Million)
13.1.8.4. Other Segments
Chapter 14. Competitive Landscape
14.1. Competitive environment, 2021
14.2. Strategic framework
14.2.1. Partnership/agreement
14.2.2. Expansion
14.2.3. Mergers & Acquisitions
14.2.4. New Size development
Chapter 15. Key Vendor Analysis
15.1. 3M Company
15.1.1. Company overview
15.1.2. Financial performance
15.1.3. Product Benchmarking
15.1.4. Recent initiatives
15.1.5. SWOT analysis
15.2. Advanced Micro Devices Inc
15.2.1. Company overview
15.2.2. Financial performance
15.2.3. Product Benchmarking
15.2.4. Recent initiatives
15.2.5. SWOT analysis
15.3. Fujitsu Limited
15.3.1. Company overview
15.3.2. Financial performance
15.3.3. Product Benchmarking
15.3.4. Recent initiatives
15.4. Intel Corporation
15.5. Amkor Technology Inc
15.6. Apple Inc
15.7. IBM Corporation
15.8. Samsung Electronics Co., Ltd.
15.9. Others
Chapter 16. Flip Chip Technologies Market Cost Analysis
16.1. Flip Chip Technologies Market Key Size Analysis
16.1.1. Key Size
16.1.2. Price Trend of Key Size
16.1.3. Key Suppliers of Size
16.1.4. Market Concentration Rate of Size
16.1.5. Labor Cost
Chapter 17. Sourcing Strategy and Downstream Buyers
17.1. Flip Chip Technologies Market Automotive Chain Analysis
17.2. Upstream Size Sourcing
17.3. Flip Chip Technologies Market Major Manufacturers in 2021
17.4. Downstream Buyers
Chapter 18. Marketing Strategy Analysis, Distributors/Traders
18.1. Marketing Channel
18.1.1. Direct Marketing
18.1.2. Indirect Marketing
18.1.3. Marketing Channel Development Trend
18.2. Market Positioning
18.2.1. Pricing Strategy
18.2.2. Brand Strategy
18.2.3. Target Client
18.3. Distributors/Traders List
Chapter 19. Market Effect Factors Analysis
19.1. Packaging Technology Progress/Risk
19.1.1. Substitutes Threat
19.1.2. Packaging Technology Progress in Related Size
19.2. Consumer Needs/Customer Preference Change
19.3. Economic/Political Environmental Change
Chapter 20. Future Outlook of the Market
Disclaimer
List of Figures
1. Market segmentation
2. Value chain analysis
3. Porter’s Five Forces’ analysis
4. Power of Suppliers
5. Power of Buyers
6. Threat of New Entrants
7. Threat of Substitute
8. Competitive Rivalry
9. Global Flip Chip Technologies Market share, By Packaging Technology, 2020 & 2027 (%)
10. Global Flip Chip Technologies Market share, by 2.5D IC, By Packaging Technology, 2015 - 2027 (USD Million)
11. Global Flip Chip Technologies Market share, by 3D IC, By Packaging Technology, 2015 - 2027 (USD Million)
12. Global Flip Chip Technologies Market share, by 2D IC, By Packaging Technology, 2015 - 2027 (USD Million)
13. Global Flip Chip Technologies Market share, By Bumping Technology, 2020 & 2027 (%)
14. Global Flip Chip Technologies Market share, by Copper Pillar, By Bumping Technology, 2015 - 2027 (USD Million)
15. Global Flip Chip Technologies Market share, by Gold Bumping, By Bumping Technology 2015 - 2027 (USD Million)
16. Global Flip Chip Technologies Market share, by Solder Bumping, By Bumping Technology 2015 - 2027 (USD Million)
17. Global Flip Chip Technologies Market share, By End-User, 2020 & 2027 (%)
18. Global Flip Chip Technologies Market share, by Electronics, By End-User, 2015 - 2027 (USD Million)
19. Global Flip Chip Technologies Market share, by Industrial, By End-User 2015 - 2027 (USD Million)
20. Global Flip Chip Technologies Market share, by Automotive, By End-User 2015 - 2027 (USD Million)
21. Global Flip Chip Technologies Market share, by Healthcare & Life Sciences, By End-User 2015 - 2027 (USD Million)
22. Global Flip Chip Technologies Market share, by Aerospace & Defense, By End-User 2015 - 2027 (USD Million)
23. Global Flip Chip Technologies Market share, by IT & Telecom, By End-User 2015 - 2027 (USD Million)
24. Global Flip Chip Technologies Market share, by region, 2020 & 2027 (%)
25. Global Flip Chip Technologies Market share, by region, 2015 - 2027(USD Million)
26. North America Flip Chip Technologies Market, 2015 - 2027(USD Million)
27. North America Flip Chip Technologies Market share, by Countries, 2020 & 2027 (%)
28. U.S. Flip Chip Technologies Market, 2015 - 2027(USD Million)
29. Canada Flip Chip Technologies Market, 2015 - 2027(USD Million)
30. Mexico Flip Chip Technologies Market, 2015 - 2027(USD Million)
31. Europe Flip Chip Technologies Market, 2015 - 2027(USD Million)
32. Europe Flip Chip Technologies Market share, by Countries, 2020 & 2027 (%)
33. Spain Flip Chip Technologies Market, 2015 - 2027(USD Million)
34. UK Flip Chip Technologies Market, 2015 - 2027(USD Million)
35. Italy Flip Chip Technologies Market, 2015 - 2027(USD Million)
36. Germany Flip Chip Technologies Market, 2015 - 2027(USD Million)
37. France Flip Chip Technologies Market, 2015 - 2027(USD Million)
38. Rest of Europe Flip Chip Technologies Market, 2015 - 2027(USD Million)
39. Asia-Pacific Flip Chip Technologies Market, 2015 - 2027(USD Million)
40. Asia-Pacific Flip Chip Technologies Market share, by Countries, 2020 & 2027 (%)
41. China Flip Chip Technologies Market, 2015 - 2027(USD Million)
42. India Flip Chip Technologies Market, 2015 - 2027(USD Million)
43. Australia Flip Chip Technologies Market, 2015 - 2027(USD Million)
44. Japan Flip Chip Technologies Market, 2015 - 2027(USD Million)
45. Rest of Asia-Pacific Flip Chip Technologies Market, 2015 - 2027(USD Million)
46. Middle East & Africa Flip Chip Technologies Market, 2015 - 2027(USD Million)
47. Middle East & Africa Flip Chip Technologies Market share, by Countries, 2020 & 2027 (%)
48. GCC Flip Chip Technologies Market, 2015 - 2027(USD Million)
49. South Africa Flip Chip Technologies Market, 2015 - 2027(USD Million)
50. Rest Of Middle East & Africa Flip Chip Technologies Market, 2015 - 2027(USD Million)
51. South America Flip Chip Technologies Market, 2015 - 2027(USD Million)
52. Brazil Flip Chip Technologies Market, 2015 - 2027(USD Million)
53. Mexico Flip Chip Technologies Market, 2015 - 2027(USD Million)
54. Argentina Flip Chip Technologies Market, 2015 - 2027(USD Million)
55. Rest Of South America Flip Chip Technologies Market, 2015 - 2027(USD Million)
List of Tables
1. Impact of Market drivers
2. Impact of Market restraints
3. Global Flip Chip Technologies Market, 2015-2027 (USD Million)
4. Flip Chip Technologies requirement, by country, 2015-2027, (USD Million)
5. North America Flip Chip Technologies Market, By Packaging Technology, 2015-2027 (USD Million)
6. North America Flip Chip Technologies Market, By Bumping Technology, 2015-2027 (USD Million)
7. North America Flip Chip Technologies Market, By End-User, 2015-2027 (USD Million)
8. Europe Flip Chip Technologies Market, By Packaging Technology, 2015-2027 (USD Million)
9. Europe Flip Chip Technologies Market, By Bumping Technology, 2015-2027 (USD Million)
10. Europe Flip Chip Technologies Market, By End-User, 2015-2027 (USD Million)
11. Asia Pacific Flip Chip Technologies Market, By Packaging Technology, 2015-2027 (USD Million)
12. Asia Pacific Flip Chip Technologies Market, By Bumping Technology, 2015-2027 (USD Million)
13. Asia Pacific Flip Chip Technologies Market, By End-User, 2015-2027 (USD Million)
14. Middle East & Africa Flip Chip Technologies Market, By Packaging Technology, 2015-2027 (USD Million)
15. Middle East & Africa Flip Chip Technologies Market, By Bumping Technology, 2015-2027 (USD Million)
16. Middle East & Africa Flip Chip Technologies Market, By End-User, 2015-2027 (USD Million)
17. South America Flip Chip Technologies Market, By Packaging Technology, 2015-2027 (USD Million)
18. South America Flip Chip Technologies Market, By Bumping Technology, 2015-2027 (USD Million)
19. South America Flip Chip Technologies Market, By End-User, 2015-2027 (USD Million)
20. Global Flip Chip Technologies Market, Company Market Share, 2020 - 2027 (%)
21. 3M Company: Product Benchmarking
22. 3M Company: Financial Performance
23. Advanced Micro Devices Inc: Product Benchmarking
24. Advanced Micro Devices Inc: Financial Performance
25. Fujitsu Limited: Product Benchmarking
26. Fujitsu Limited: Financial Performance
27. Intel Corporation: Product Benchmarking
28. Intel Corporation: Financial Performance
29. Amkor Technology Inc: Product Benchmarking
30. Amkor Technology Inc: Financial Performance
31. Apple Inc: Product Benchmarking
32. Apple Inc: Financial Performance
33. IBM Corporation: Product Benchmarking
34. IBM Corporation: Financial Performance
35. Samsung Electronics Co., Ltd.: Product Benchmarking
36. Samsung Electronics Co., Ltd.: Financial Performance
The Leading Key Players in Flip Chip Technologies Market
